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Spire is proud to release the newest version of the Positivo fanless copper heat-sink series. The Positivo Pro, part number: SP588-1U is a thermally advanced passive heat-sink solution for Intel LGA 775 processors in 1U server chassis. The heatsink is made of pure copper with skived fins technology ensuring rapid heat transfer and efficient dissipation. Pre-applied spring-screws and mainboard back-plate guarantee safe and secure installation.
Main Features:
* Pure copper heat-sink
* Low profile - 1U (rack-mount application only)
* Passive heat-sink 0dBA
* Most effective with indirect air-ducting
Product Includes :
* Multilanguage Owners Manual * Back plate * Stars-420 Thermal compound
 | Product Specification |  |
| Dimensions | | Heat sink : | 87×83×27 mm (l × w × h) | | 12VDC Fan : | 105×105×25 mm |
| | Rated speed | | Cooler : | 0 RPM +/-10% | | Only Fan : | 0 RPM +/-10% |
| | Noise level | 0 dBA | | Connector | N.A. | | Application | Intel Core 2 Duo (775 Dual-core)
Intel Core 2 Quad (775 Quad-core)
Intel LGA775 (Prescott)
Intel Pentium D (775 Dual-Core)
Intel Socket 775 1U Server
| | TDP | 95 W | | Thermal resistance | 0.28 oC/W | | Thermal paste | Stars-420 white grease(Injection Tube,0.5g) | | Life hours | 30,000H | | Warranty | 3 years | | Packaging type | color box | | Package includes | Black Plate,Stars-420,manual | | N.W | 0.49 KG | | G.W | 0.575 KG | | Features | All Copper Heatsink,1U Rackmount | | UPC Code | 6943051203690 |
| * All Spire CPU cooling products come with thermal compound either pre-applied onto the cooler or in an injection tube. Compound will begin to function at its optimum potential, after a gradual increase in heat-dissipation, approximately 150 hours (6days) after initial application. |
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| * All technical data shown above are measurements from our own laboratory. Product images shown may differ from actual product. Specifications are subject to change without prior notice. |
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Downloads |
 | High Resolution Image |  | | | | Product Manual | | | |
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